Metal (copper, aluminum) bump substrate
Direct heat dissipation from the LED's neutral terminal! A substrate with a structure that efficiently releases heat.
The "Metal (Copper, Aluminum) Bump Substrate" is a product handled by Arrow Industries, which manufactures and sells substrates for industrial equipment, semiconductor bare chip mounting, and consumer electronics. It features a structure that directly connects the heat dissipation fins of UV LEDs, high-brightness LEDs, and high-power semiconductors to the metal bump section, allowing heat to escape efficiently. 【Features】 ■ Direct heat dissipation from the neutral electrode of the LED ■ Structure that efficiently dissipates heat *For more details, please refer to the PDF document or feel free to contact us.
- Company：アロー産業
- Price：Other
